Description
* 100% New Heatsink plaster.
* Application: apply to all heatsinkf no fixed clip thermal paste. Idea for MOSFET Heatsink，VGA CARD Northbridge Southbridge Heatsink.
* Features: thermal properties, strong adhesion
* Melting capacity: 0 (200 ℃ / 24Hours)
* Evaporation: 0.001% (200 ℃ / 24Hours)
* Thermal conductivity:> 1.2W/m-K
* Thermal Impedance: <0.06
* Clotting time: 3min (25 ℃)
* Strength of connected buildings: 25Kg
* Insulation coefficient> 5.1
* Dissipation coefficient <0.005
* Temperature resistance: 200 ℃
* Net Weight: 10g
Package Includes:
1 x Thermal Heatsink Plaster Glue.
